QVS212CG470JDHT [TAIYO YUDEN]

Capacitor, Ceramic, Chip, General Purpose, 47pF, 250V, ±5%, C0G/NP0, 0805 (2012 mm), 0.008"T, -55º ~ +125ºC, 7" Reel/4mm pitch;


型号：	QVS212CG470JDHT
厂家：	TAIYO YUDEN (U.S.A.), INC
描述：	Capacitor, Ceramic, Chip, General Purpose, 47pF, 250V, ±5%, C0G/NP0, 0805 (2012 mm), 0.008"T, -55º ~ +125ºC, 7" Reel/4mm pitch 电容器
文件：	总26页 (文件大小：770K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

[ For High Quality and/or Reliability Equipment

(Automotive / Industrial Equipment) ]

Notice for TAIYO YUDEN Products

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product information in this catalog is as of October 2017. All of the contents speciﬁed herein are subject to change

without notice due to technical improvements, etc. Therefore, please check for the latest information carefully

before practical application or use of our products.

Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or

equipment incorporating our products, which are caused under the conditions other than those speciﬁed in this

catalog or individual product speciﬁcation sheets.

■ Please contact TAIYO YUDEN for further details of product speciﬁcations as the individual product speciﬁcation

sheets are available.

■ Please conduct validation and verification of our products in actual condition of mounting and operating

environment before using our products.

■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA

equipment, home electric appliances, office equipment, information and communication equipment), medical

equipment classiﬁed as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc.

Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which

may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation,

automotive powertrain control system, train control system, and ship control system, traffic signal equipment,

medical equipment classiﬁed as Class III by IMDRF).

Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g.,

aerospace equipment, aviation equipment*, medical equipment classiﬁed as Class IV by IMDRF, nuclear control

equipment, undersea equipment, military equipment).

*Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g.,

in-ﬂight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements speciﬁed separately by TAIYO YUDEN.

Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment.

When our products are used even for high safety and/or reliability-required devices or circuits of general electronic

equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to

install a protection circuit as necessary.

Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way

responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog

for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above.

■ Information contained in this catalog is intended to convey examples of typical performances and/or applications

of our products and is not intended to make any warranty with respect to the intellectual property rights or any

other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights.

■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and

TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products.

Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality

assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in

accordance with such agreement.

■ The contents of this catalog are applicable to our products which are purchased from our sales offices or

authorized distributors (hereinafter“TAIYO YUDENs’ofﬁcial sales channel”). Please note that the contents of this

catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’s official sales

channel.

■ Caution for Export

Some of our products listed in this catalog may require speciﬁc procedures for export according to“U.S. Export

Administration Regulations”,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable

regulations. Should you have any questions on this matter, please contact our sales staff.

MULTILAYER CERAMIC CAPACITORS

REFLOW

AEC- Q200

■PART NUMBER

△＝Blank space

△

⑤

△

⑫

①

②

③

④

⑥

⑦

⑧

⑨

⑩

⑪

①Rated voltage

③End termination

Code

Rated voltage［VDC］

Code

End termination

Plated

6.3

Soft Termination

Cu Internal Electrodes

High Reliability Application

④Dimension（L×W）

Dimensions

Type

063

EIA（inch）

（L×W）［mm］

0.6 × 0.3

100

250

630

0201

0402

0204

0603

0306

0805

0508

1206

1210

1812

1.0 × 0.5

105

0.52× 1.0

1.6 × 0.8

0.8 × 1.6

2.0 × 1.25

1.25× 2.0

3.2 × 1.6

3.2 × 2.5

4.5 × 3.2

※

②Series name

107

212

※

Code

Series name

Multilayer ceramic capacitor

Multilayer ceramic capacitor for high frequency

LW reverse type multilayer capacitor

316

325

432

Note : ※LW reverse type（□WK） only

⑤Dimension tolerance

Code

△

Type

ALL

063

L［mm］

W［mm］

T［mm］

Standard

0.6±0.05

1.0±0.10

0.3±0.05

0.5±0.10

105

0.5±0.10

107

1.6＋0.15/－0.05

0.8＋0.15/－0.05

0.85±0.10

212

2.0＋0.15/－0.05

1.25＋0.15/－0.05

1.6±0.20

316

325

105

107

3.2±0.20

1.6±0.20

3.2±0.30

2.5±0.30

1.0＋0.15/－0.05

1.6＋0.20/－0

0.5＋0.15/－0.05

0.8＋0.20/－0

0.5＋0.15/－0.05

0.8＋0.20/－0

0.85±0.10

212

2.0＋0.20/－0

1.25＋0.20/－0

1.6±0.30

316

105

107

212

3.2±0.30

1.6±0.30

1.0＋0.20/－0

1.6＋0.25/－0

2.0＋0.25/－0

2.0±0.15

0.5＋0.20/－0

0.8＋0.25/－0

1.25＋0.25/－0

1.25±0.15

0.5＋0.20/－0

0.8＋0.25/－0

1.25＋0.25/－0

0.85±0.15

1.15±0.20

316

325

3.2±0.20

1.6±0.20

3.2±0.50

2.5±0.30

Note: ｃｆ. STANDARD EXTERNAL DIMENSIONS

△= Blank space

⑥Temperature characteristics code

■High dielectric type

Applicable

Temperature

Ref. Temp.［℃］

range［℃］

Capacitance

tolerance

±10％

±20％

±10％

±20％

±10％

±20％

±10％

±20％

±10％

±20％

Tolerance

Code

Capacitance change

±15％

standard

code

EIA

X5R

X6S

X7R

X7S

X7T

－55～＋ 85

－55～＋105

－55～＋125

±22％

±15％

±22％

＋22％/－33％

▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspeciﬁcationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspeciﬁcationꢀsheets.ꢀ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■Temperature compensating type

Applicable

Temperature

range［℃］

Capacitance

tolerance

±0.1pF

±0.25pF

±0.5pF

±1pF

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

0±30ppm/℃

standard

code

JIS

EIA

－55～＋125

C0G

±2％

±5％

⑦Nominal capacitance

⑨Thickness

Code

Thickness［mm］

0.3

Nominal capacitance

（example）

0R5

0.5pF

1pF

010

0.5

100

10pF

0.7(107type or more)

101

100pF

1,000pF

0.01μF

0.1μF

1.0μF

10μF

0.8

102

0.85(212type or more)

103

1.15

1.25

1.6

104

105

106

1.9

107

100μF

2.5

Note : R＝Decimal point

⑩Special code

Code

⑧Capacitance tolerance

Special code

Code

Capacitance tolerance

±0.1pF

MLCC for Industrial and Automotive

±0.25pF

±0.5pF

⑪Packaging

Code

Packaging

±2％

φ178mm Taping （2mm pitch）

±5％

φ178mm Embossed Taping （4mm pitch）

φ178mm Taping （4mm pitch）

±10％

±20％

φ178mm Taping （4mm pitch, 1000 pcs/reel）

325 type（Thickness code M）

⑫Internal code

Code

△

Internal code

Standard

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■STANDARD EXTERNAL DIMENSIONS

Dimension [mm] （inch）

Type( EIA )

0.6±0.03

0.3±0.03

0.15±0.05

□MK063（0201）

(0.024±0.001)

1.0±0.05

(0.012±0.001)

0.5±0.05

(0.012±0.001)

0.5±0.05

(0.006±0.002)

0.25±0.10

□MK105（0402）

□MF105（0402）

Ｆ

(0.039±0.002)

0.52±0.05

(0.020±0.002)

1.0±0.05

(0.020±0.002)

0.3±0.05

(0.010±0.004)

0.18±0.08

□WK105（0204）※

(0.020±0.002)

1.6±0.10

(0.039±0.002)

0.8±0.10

(0.012±0.002)

0.8±0.10

(0.007±0.003)

0.35±0.25

□MK107（0603）

□MF107（0603）

(0.063±0.004)

1.6±0.10

(0.031±0.004)

0.8±0.10

(0.031±0.004)

0.8±0.10

(0.014±0.010)

0.35＋0.3/－0.25

(0.014＋0.012/－0.010)

0.35±0.25

□MJ107（0603）

□VS107（0603）

□WK107（0306）※

(0.063±0.004)

1.6±0.10

(0.031±0.004)

0.8±0.10

(0.031±0.004)

0.7±0.10

(0.063±0.004)

0.8±0.10

(0.031±0.004)

1.6±0.10

(0.028±0.004)

0.5±0.05

(0.014±0.010)

0.25±0.15

(0.031±0.004)

(0.063±0.004)

(0.020±0.002)

0.85±0.10

(0.010±0.006)

(0.033±0.004)

1.25±0.10

□MK212（0805）

□MF212（0805）

2.0±0.10

1.25±0.10

0.5±0.25

(0.079±0.004)

(0.049±0.004)

(0.020±0.010)

(0.049±0.004)

0.85±0.10

※ LW reverse type

(0.033±0.004)

1.25±0.10

2.0±0.10

1.25±0.10

0.5＋0.35/－0.25

□MJ212（0805）

(0.079±0.004)

(0.049±0.004)

（0.020＋0.014/－0.010）

(0.049±0.004)

0.85±0.10

2.0±0.10

(0.079±0.004)

1.25±0.15

1.25±0.10

(0.049±0.004)

2.0±0.15

0.5±0.25

(0.020±0.010)

0.3±0.2

□VS212（0805）

(0.033±0.004)

0.85±0.10

□WK212（0508）※

(0.049±0.006)

(0.079±0.006)

(0.033±0.004)

(0.012±0.008)

1.15±0.10

(0.045±0.004)

□MK316（1206）

□MF316（1206）

3.2±0.15

1.6±0.15

0.5＋0.35/－0.25

(0.126±0.006)

(0.063±0.006)

（0.020＋0.014/－0.010）

1.6±0.20

(0.063±0.008)

1.15±0.10

Ｆ

(0.045±0.004)

3.2±0.15

1.6±0.15

0.6＋0.4/－0.3

□MJ316（1206）

(0.126±0.006)

(0.063±0.006)

（0.024＋0.016/－0.012）

1.6±0.20

(0.063±0.008)

1.15±0.10

(0.045±0.004)

1.9±0.20

□MK325（1210）

□MF325（1210）

3.2±0.30

2.5±0.20

0.6±0.3

(0.075±0.008)

2.5±0.20

(0.126±0.012)

(0.098±0.008)

(0.024±0.012)

(0.098±0.008)

1.9±0.20

(0.075±0.008)

2.5±0.20

3.2±0.30

2.5±0.20

0.6＋0.4/－0.3

□MJ325（1210）

□MK432（1812）

(0.126±0.012)

(0.098±0.008)

（0.024＋0.016/－0.012）

(0.098±0.008)

2.5±0.20

4.5±0.40

3.2±0.30

0.9±0.6

(0.177±0.016)

(0.126±0.012)

(0.098±0.008)

(0.035±0.024)

Note : ※. LW reverse type, *1.Thickness code

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■STANDARD QUANTITY

Dimension

Standard quantity［pcs］

Type

063

EIA（inch）

［ｍｍ］

0.3

Code

Paper tape

Embossed tape

－

0201

15000

0402

0.5

105

10000

－

0204 ※

0.30

0.7

4000

0.8

3000

0603

0.8

107

（Soft Termination）

3000

－

（Soft Termination）

0306 ※

0805

0.50

0.85

1.25

－

4000

－

4000

－

3000

212

316

2000

1.25

－

（Soft Termination）

0508 ※

1206

0.85

1.15

1.6

4000

－

3000

2000

－

1.15

1.9

－

2000

325

432

1210

1812

2.5

－

500（T），1000（P）

500

2.5

Note : ※.LW Reverse type（□WK）

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

Soft Termination Multilayer Ceramic Capacitors

●107TYPEꢀ (Dimension:1.6×0.8mmꢀJIS:1608ꢀEIA:0603）

【Temperature Characteristic B7 : X7R】ꢀ0.8mm thickness（A）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

TMJ107BB7473[]AHT

TMJ107BB7104[]AHT

TMJ107BB7224[]AHT

TMJ107BB7474[]AHT

TMJ107CB7105[]AHR

GMJ107BB7473[]AHT

GMJ107BB7104[]AHT

GMJ107BB7224[]AHT

GMJ107BB7474[]AHT

GMJ107CB7105[]AHR

UMJ107AB7102[]AHT

UMJ107AB7222[]AHT

UMJ107BB7472[]AHT

UMJ107BB7103[]AHT

UMJ107BB7223[]AHT

UMJ107BB7473[]AHT

UMJ107BB7104[]AHT

HMJ107AB7102[]AHT

HMJ107AB7222[]AHT

HMJ107BB7472[]AHT

HMJ107BB7103[]AHT

HMJ107BB7223[]AHT

HMJ107BB7473[]AHT

HMJ107BB7104[]AHT

X7R

0.047 μ

0.1 μ

±10, ±20

3.5

200

150

200

150

200

0.8+0.20/-0

0.8+0.25/-0

0.8+0.20/-0

0.8+0.25/-0

0.8+0.15/-0.05

0.8+0.20/-0

0.8+0.15/-0.05

0.8+0.20/-0

*1, *2

0.22 μ

0.47 μ

1 μ

0.047 μ

0.1 μ

3.5

0.22 μ

0.47 μ

1 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

3.5

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

100

●212TYPEꢀ(Dimension:2.0×1.25mmꢀJIS:2012ꢀEIA:0805）

【Temperature Characteristic B7 : X7R , C7 : X7S】 0.85mm thickness（D）、1.25mm thickness（G）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

JMJ212CB7106[]GHT

EMJ212CB7225[]GHT

EMJ212CB7475[]GHT

TMJ212CB7225[]GHT

GMJ212CB7105[]GHT

UMJ212BB7103[]GHT

UMJ212BB7223[]GHT

UMJ212BB7473[]GHT

UMJ212BB7104[]GHT

UMJ212BB7224[]GHT

UMJ212CC7474[]GHTE

UMJ212CB7105[]GHT

HMJ212KB7102[]DHT

HMJ212KB7222[]DHT

HMJ212BB7472[]GHT

HMJ212BB7103[]GHT

HMJ212BB7223[]GHT

HMJ212BB7473[]GHT

HMJ212BB7104[]GHT

HMJ212BB7224[]GHT

HMJ212CC7474[]GHTE

QMJ212KB7102[]DHT

QMJ212KB7222[]DHT

QMJ212BB7472[]GHT

QMJ212BB7103[]GHT

QMJ212BB7223[]GHT

6.3

X7R

X7S

X7R

X7S

X7R

10 μ

2.2 μ

±10, ±20

150

200

150

200

150

1.25+0.25/-0

1.25+0.20/-0

1.25+0.25/-0

0.85±0.15

*1, *2

4.7 μ

2.2 μ

1 μ

0.01 μ

0.022 μ

0.047 μ

0.1 μ

2.5

3.5

0.22 μ

0.47 μ

1 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

3.5

2.5

0.85±0.15

1.25+0.20/-0

1.25+0.25/-0

0.85±0.15

100

250

0.22 μ

0.47 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.85±0.15

1.25+0.20/-0

●316TYPE (Dimension:3.2×1.6mmꢀJIS:3216ꢀEIA:1206）

【Temperature Characteristic B7 : X7R , C7 : X7S】 1.15mm thickness（F）、1.6mm thickness（L）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

LMJ316BB7226[]LHT

EMJ316BB7475[]LHT

EMJ316BB7106[]LHT

TMJ316BB7474[]LHT

TMJ316BB7475[]LHT

TMJ316BB7106[]LHT

GMJ316BB7474[]LHT

GMJ316AB7225[]LHT

GMJ316BB7475[]LHT

GMJ316BB7106[]LHT

UMJ316BB7473[]LHT

UMJ316BB7104[]LHT

UMJ316BB7224[]LHT

UMJ316BB7474[]LHT

UMJ316BB7105[]LHT

UMJ316AB7225[]LHT

UMJ316BC7475[]LHTE

X7R

X7S

22 μ

4.7 μ

10 μ

±10, ±20

150

200

150

200

150

200

150

1.6±0.30

1.6±0.20

1.6±0.30

1.6±0.20

1.6±0.30

*1, *2

0.47 μ

4.7 μ

10 μ

3.5

0.47 μ

2.2 μ

4.7 μ

10 μ

3.5

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

3.5

2.2 μ

4.7 μ

2.5

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

Part number 1

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 2

Note

Rated voltage x ％

HMJ316 B7102[]FHT

HMJ316 B7222[]FHT

HMJ316 B7472[]FHT

HMJ316KB7103[]FHT

HMJ316BB7223[]LHT

HMJ316BB7473[]LHT

HMJ316BB7104[]LHT

HMJ316BB7224[]LHT

HMJ316BB7474[]LHT

HMJ316BB7105[]LHT

HMJ316BC7225[]LHTE

QMJ316 B7102[]FHT

QMJ316 B7222[]FHT

QMJ316 B7472[]FHT

QMJ316KB7103[]FHT

QMJ316BB7223[]LHT

QMJ316BB7473[]LHT

QMJ316BB7104[]LHT

SMJ316 B7102[]FHT

SMJ316 B7222[]FHT

SMJ316 B7472[]FHT

SMJ316KB7103[]FHT

SMJ316BB7223[]LHT

X7R

X7S

X7R

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

±10, ±20

3.5

2.5

200

150

120

1.15±0.10

1.15±0.20

1.6±0.30

1.15±0.10

1.15±0.20

1.6±0.30

1.15±0.10

1.15±0.20

1.6±0.30

*1, *2

100

0.22 μ

0.47 μ

1 μ

2.2 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

250

630

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

●325TYPE (Dimension:3.2×2.5mmꢀJIS:3225ꢀEIA:1210）

【Temperature Characteristic B7 : X7R , C7 : X7S】 1.9mm thickness（N）、2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

JMJ325KB7476[]MHP

EMJ325KB7226[]MHP

TMJ325AB7475[]MHP

TMJ325KB7106[]MHP

GMJ325AB7475[]MHP

GMJ325KB7106[]MHP

UMJ325AB7225[]MHP

UMJ325AB7475[]MHP

UMJ325KB7106[]MHP

HMJ325 B7223[]NHT

HMJ325 B7473[]NHT

HMJ325 B7104[]NHT

HMJ325 B7224[]NHT

HMJ325 B7474[]NHT

HMJ325 B7105[]NHT

HMJ325AB7225[]MHP

HMJ325KC7475[]MHPE

QMJ325 B7223[]NHT

QMJ325 B7473[]NHT

QMJ325 B7104[]NHT

QMJ325 B7224[]NHT

SMJ325 B7223[]NHT

SMJ325 B7473[]NHT

6.3

X7R

X7S

X7R

47 μ

22 μ

±10, ±20

150

200

150

200

150

120

2.5±0.30

1.9±0.20

2.5±0.30

1.9±0.20

*1, *2

4.7 μ

10 μ

4.7 μ

10 μ

3.5

2.2 μ

4.7 μ

10 μ

3.5

2.5

0.022 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

100

2.2 μ

4.7 μ

0.022 μ

0.047 μ

0.1 μ

250

630

0.22 μ

0.022 μ

0.047 μ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

Multilayer Ceramic Capacitors

■PACKAGING

①Minimum Quantity

●Taped package

Thickness

Standard quantity [pcs]

Type(EIA)

code

Paper tape

Embossed tape

□MK021(008004)

□VS021(008004)

□MK042(01005)

□VS042(01005)

□MK063(0201)

0.125

－

50000

0.2

C, D

P,T

40000

0.3

15000

10000

－

□WK105(0204) ※

0.3

0.13

0.18

0.2

20000

15000

－

□MK105(0402)

□MF105(0402)

20000

15000

10000

4000

－

0.3

－

0.5

－

□VK105(0402)

□MK107(0603)

□WK107(0306) ※

□MF107(0603)

□VS107(0603)

□MJ107(0603)

0.5

－

0.45

0.5

－

4000

－

0.8

4000

3000

0.7

－

0.8

3000

0.45

0.85

1.25

0.85

1.25

0.85

1.15

1.6

□MK212(0805)

4000

－

□WK212(0508)

□MF212(0805)

※

－

4000

－

3000

－

□VS212(0805)

□MJ212(0805)

－

2000

－

4000

－

□MK316(1206)

□MF316(1206)

3000

2000

3000

2000

－

1.15

1.6

－

□MJ316(1206)

－

0.85

1.15

1.9

－

2000

□MK325(1210)

□MF325(1210)

2.0max.

2.5

－

1000

2000

1.9

□MJ325(1210)

□MK432(1812)

2.5

500(T), 1000(P)

500

2.5

Note : ※ LW Reverse type.

②Taping material

※No bottom tape for pressed carrier tape

●Card board carrier tape

●Embossed tape

Top tape

Base tape

Sprocket hole

Chip cavity

Sprocket hole

Chip cavity

Bottom tape

Base tape

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Chip filled

Chip

※ LW Reverse type.

③Representative taping dimensions

●Paper Tape（8mm wide）

●Pressed carrier tape（ 2mm pitch）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

2.0±0.05

4.0±0.1

(0.079±0.002) (0.157±0.004)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

Ｔ

□MK063(0201)

0.37

0.67

0.45max.

0.42max.

□WK105(0204) ※

□MK105(0402) （*1 C）

□MK105(0402) （*1 P）

2.0±0.05

0.65

1.15

0.4max.

0.3max.

0.42max.

Unit：mm

0.45max.

Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.

●Punched carrier tape （2mm pitch）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

2.0±0.05

4.0±0.1

(0.079±0.002) (0.157±0.004)

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK105 (0402)

□MF105 (0402)

□VK105 (0402)

0.65

1.15

2.0±0.05

0.8max.

Unit：mm

●Punched carrier tape （4mm pitch）

φ1.5＋0.1/－0

Unit：mm（inch）

1.75±0.1

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

4.0±0.1

(0.157±0.004)

2.0±0.1

(0.079±0.004)

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK107(0603)

□WK107(0306)

□MF107(0603)

□MK212(0805)

□WK212(0508)

□MK316(1206)

※

1.0

1.8

1.1max.

4.0±0.1

1.65

2.0

2.4

3.6

1.1max.

Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.

Unit：mm

●Embossed tape（4mm wide）

Sprocket hole

Unit：mm（inch）

0.9±0.05

φ0.8±0.04

(0.035±0.002)

(φ0.031±0.002)

1.0±0.02

2.0±0.04

(0.039±0.001) (0.079±0.002)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK021(008004)

□VS021(008004)

□MK042(01005)

□VS042(01005)

0.135

0.27

1.0±0.02

0.5max.

0.25max.

Unit：mm

0.23

0.43

●Embossed tape（8mm wide）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

4.0±0.1

(0.157±0.004)

2.0±0.1

(0.079±0.004)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK105(0402)

0.6

1.0

1.1

1.8

2.0±0.1

0.6max

1.3max.

0.2±0.1

0.25±0.1

□WK107(0306) ※

□MK212(0805)

1.65

2.0

2.4

3.6

□MF212(0805)

4.0±0.1

□MK316(1206)

□MF316(1206)

3.4max.

0.6max.

□MK325(1210)

2.8

□MF325(1210)

Note： ※ LW Reverse type.

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

●Embossed tape（12mm wide）

φ1.5＋0.1/－0

(φ0.059＋0.004/-0)

Unit：mm（inch）

1.75±0.1

(0.069±0.004）

Sprocket hole

4.0±0.1

2.0±0.1

(0.157±0.004)

(0.079±0.004)

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

□MK325(1210)

□MK432(1812)

3.1

3.7

4.0

4.9

8.0±0.1

4.0max.

0.6max.

Unit：mm

④Trailer and Leader

Blank portion

Chip cavity

Blank portion

Leader

100mm or more

160mm or more

(3.94inches or more)

(6.3inches or more)

400mm or more

(15.7inches or more)

Direction of tape feed

⑤Reel size

φ13.0±0.2

φ178±2.0

φ50min.

φ21.0±0.8

2.0±0.5

1.0

4mm wide tape

8mm wide tape

12mm wide tape

1.5max.

2.5max.

5±1.0

10±1.5

14±1.5

Unit：mm

⑥Top Tape Strength

The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.

Pull direction

0～20°

Top tape

Base tape

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Multilayer Ceramic Capacitors

■RELIABILITY DATA

1.Operating Temperature Range

Standard

Temperature

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

X5R

X7R

X6S

X7S

X7T

X5R

Specified

Value

High Permittivity （Class2）

LD(※)

Note: ※LD Low distortion high value multilayer ceramic capacitor

2. Storage Conditions

Temperature

Standard

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

X5R

Specified

Value

X7R

High Permittivity （Class2）

X6S

X7S

X7T

LD(※)

X5R

Note: ※LD Low distortion high value multilayer ceramic capacitor

3. Rated Voltage

Standard

50VDC, 25VDC

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type 50VDC, 25VDC

50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC

High Permittivity （Class2）

4. Withstanding Voltage （Between terminals）

Temperature

Specified

Standard

Compensating（Class1）

High Frequency Type No breakdown or damage

Value

High Permittivity （Class2）

Class 1

Class 2

Rated voltage×2.5

Test

Applied voltage

Methods and

Duration

Rated volta×3

1 to 5 sec.

50mA max.

Remarks

Charge/discharge current

5. Insulation Resistance

Temperature

Standard

High Frequency Type

10000 MΩmin.

Compensating（Class1）

Specified

Value

C≦0.047μF : 10000 MΩ min.

C＞0.047μF : 500MΩ・μF

High Permittivity （Class2） Note 1

Test

Applied voltage

Duration

: Rated voltage

Methods and

Remarks

: 60±5 sec.

: 50mA max.

Charge/discharge current

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

6. Capacitance （Tolerance）

Temperature

0.2pF≦C≦5pF

0.2pF≦C≦10pF

C＞10pF

: ±0.25pF

C□

U□

Standard

: ±0.5pF

: ±5% or ±10%

Compensating（Class1）

Specified

Value

0.3pF≦C≦2pF

C＞2pF

: ±0.1pF

: ±5%

High Frequency Type

BJ, B7, C6, C7, D7, LD(※) : ±10% or ±20%

High Permittivity （Class2）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

C≦10μF

C＞10μF

Test

Preconditioning

None

Thermal treatment （at 150℃ for 1hr） Note 2

Methods and

Remarks

Measuring frequency

Measuring voltage Note

Bias application

1ＭHz±10%

0.5 to 5Vrms

1kHz±10%

1±0.2Vrms

120±10Hz

0.5±0.1rms

one

7. Q or Dissipation Factor

C＜30pF : Q≧400＋20C

C≧30pF : Q≧1000

Standard

Temperature

Compensating（Class1）

（C：Nominal capacitance）

Specified

Value

High Frequency Type Refer to detailed specification

High Permittivity （Class2） Note 1

BJ, B7, C6, C7, D7：2.5% max.

Class 1

High Frequency Type

None

Class 2

Standard

C≦10μF

C＞10μF

Preconditioning

Thermal treatment （at 150℃ for 1hr） Note 2

Test

Measuring frequey

Measuring voltage Note 1

Bias application

1ＭHz±10%

1GHz

1ｋHz±10%

1±0.2Vrms

120±10Hz

Methods and

Remarks

0.5 to 5Vrms

0.5±0.1Vrms

None

High Frequency Type

Measuring equipment

Measuring jig

: HP4291A

: HP16192A

8. Temperature Characteristic （Without voltage application）

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

G : ±30

H : ±60

J : ±120

K : ±250

C□ :

CG,CH, CJ, CK

UJ, UK

Standard

Temperature

U□ : －750

Compensating（Class1）

SL : ＋350 to －1000

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

H : ±60

High Frequency Type

C□ :

Specified

Value

Capacitance

change

±10%

Reference

Specification

Temperature Range

temperature

20℃

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

X5R

X7R

X6S

X7S

X5R

±15%

25℃

±15%

25℃

High Permittivity （Class2）

±22%

25℃

±22%

25℃

＋22/－33%

±15%

25℃

LD(※)

25℃

Note : ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

（C₈₅－C₂₀）

×10⁶（ppm/℃）

C₂₀×△T

△T＝65

Class 2

Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following

equation.

Test

Methods and

Remarks

Step

X5R、X7R、X6S、X7S、X7T

Minimum operating temperature

20℃

25℃

Maximum operating temperature

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

（C－C₂）

C₂

×100（%）

：Capacitance in Step 1 or Step 3

C2 ：Capacitance in Step 2

9. Deflection

Appearance

: No abnormality

Standard

Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.

Temperature

Compensating（Class1）

Appearance

: No abnormality

: Within±0.5 pF

Specified

Value

High Frequency Type

Cpaitance change

Appearance

: No abnormality

High Permittivity （Class2）

Capacitance change : Within ±12.5%（BJ, B7, C6, C7, D7, LD(※)）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Multilayer Ceramic Capacitors

042, 063, ^※１105 Type

The other types

Board

Glass epoxy-resin substrate

Test

Thickness

Warp

0.8mm

1.6mm

Methods and

Remarks

1mm （Soft Termination type:3mm）

Duration

10 sec.

^※１：105 Type thickness, C： 0.2mm ,P： 0.3mm.

Capacitance measurement shall be conducted

with the board bent

10. Body Strength

Standard

－

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type No mechanical damage.

－

High Permittivity （Class2）

High Frequency Type

Applied force

Duration

: 5N

Test

: 10 sec.

Methods and

Remarks

11. Adhesive Strength of Terminal Electrodes

Temperature

Standard

Specified

Compensating（Class1）

High Frequency Type No terminal separation or its indication.

Value

High Permittivity （Class2）

Multilayer Ceramic Capacitors

042, 063 Type

105 Type or more

Test

Applied force

Duration

Methods and

Remarks

30±5 sec.

12. Solderability

Standard

High Frequency Type At least 95% of terminal electrode is covered by new solder.

Temperature

Specified

Value

Compensating（Class1）

High Permittivity （Class2）

Eutectic solder

H60A or H63A

230±5℃

Lead-free solder

Sn-3.0Ag-0.5Cu

245±3℃

Test

Solder type

Methods and

Remarks

Solder temperature

Duration

4±1 sec.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

13. Resistance to Soldering

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitancecange

: Within ±2.5%

: Initial value

Specified

Value

High Frequency Type

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Appearance

: No abormality

Capactace change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within ±7.5%（BJ, B7, C6, C7, D7, LD(※)）

: Initial value

High Permittivity （Class2） Note 1

: Initial value

（between terminals）: No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

lss 1

042, 063 Type

105 Type

Preconditioning

Preheating

None

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

6 to 24 hrs （Standard condition） Noe 5

Test

Methods and

Remarks

Class 2

105, 107, 212 Type

042、063 Type

316, 325 Type

Preconditioning

Preheating

Thermal treatment （at 150℃ for 1 hr） Note 2

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

80 to 100℃, 5 to 10 min.

150 to 200℃, 5 to 10 min.

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

24±2 hrs （Standard condition） Note 5

14. Temperature Cycle (Thermal Shock）

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: Within ±0.25pF

Specified

Value

High Frequency Type

: Initial value

Insulation resistance

Withstanding voltage

（between terminals） : No abnormality

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within ±7.5% （BJ, B7, C6, C7, D7, LD(※)）

: Initial value

High Permittivity （Class2） Note 1

: Initial value

（between terminals） : No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

None

Class 2

Thermal treatment （at 150℃ for 1 hr）

Note 2

Preconditioning

Step

Temperature（℃）

Time（min.）

Test

Minimum operating temperature

Normal temperature

30±3

2 to 3

30±3

2 to 3

Methods and

Remarks

1 cycle

Maximum operating temperature

Normal temperature

Number of cycles

Recovery

5 times

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

15. Humidity （Steady State）

Appearance

: No abnormality

Capacitance change

: Within ±5% or ±0.5pF, whichever is larger.

: C＜10pF : Q≧200＋10C

Standard

10≦C＜30pF : Q≧275＋2.5C

C≧30pF:Q≧350（C：Nominal capacitance）

: 1000 MΩmin.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

Specified

Value

: No abnormality

: Within ±0.5pF,

: 1000 MΩmin.

High Frequency Type Capacitance change

Insulation resistance

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）

: 5.0% max.（BJ, B7, C6, C7, D7, LD(※)）

: 50 MΩμF or 1000 MΩwhichever is smaller.

High Permittivity （Class2） Note 1

Dissipation factor

Insulation resistance

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

All items

Standard

40±2℃

High Frequency Type

60±2℃

Preconditioning

Temperature

Humidity

None

Thermal treatment（ at 150℃ for 1 hr） Note 2

40±2℃

Test

Methods and

Remarks

90 to 95%RH

Duration

500＋24/－0 hrs

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

16. Humidity Loading

Appearance

: No abnormality

Capacitance change

: Within ±7.5% or ±0.75pF, whichever is larger.

: C＜30pF：Q≧100＋10C/3

Standard

C≧30pF：Q≧200 （C：Nominal capacitance）

: 500 MΩmin.

Insulation resistance

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: C≦2pF：Within ±0.4 pF

C＞2pF：Within ±0.75 pF

（C：Nominal capacitance）

: 500 MΩmin.

Specified

Value

High Frequency Type

Insulation resistance

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）

: 5.0% max. （BJ, B7, C6, C7, D7, LD(※)）

: 25 MΩμF or 500 MΩ, whichever is smaller.

High Permittivity （Class2） Note 1

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

Standard

High Frequency Type

All items

Preconditioning

Voltage treatment

None

（Rated voltage are applied for 1 hour at 40℃） Note 3

Temperature

Humidity

40±2℃

60±2℃

40±2℃

Test

Methods and

Remarks

90 to 95%RH

500＋24/－0 hrs

Rated voltage

90 to 95%RH

Duration

500＋24/－0 hrs

Rated voltage

Applied voltage

Charge/discharge

current

50mA max.

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs（Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

17. High Temperature Loading

Appearance

: No abnormality

Capacitance change

: Within ±3% or ±0.3pF, whichever is larger.

: C＜10pF： Q≧200＋10C

Standard

10≦C＜30pF：Q≧275＋2.5C

C≧30pF： Q≧350（C：Nominal capacitance）

: 1000 MΩmin.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

Specified

Value

: No abnormality

High Frequency Type Capacitance change

Insulation resistance

: Within ±3% or ±0.3pF, whichever is larger.

: 1000 MΩmin.

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）

: 5.0% max.（BJ, B7, C6, C7, D7, LD(※)）

: 50 MΩμF or 1000 MΩ, whichever is smaller.

High Permittivity （Class2） Note 1

Dissipation factor

Insulation resistance

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

BJ, LD(※)

B7, C7, D7

Voltage treatment（Twice the rated voltage shall be applied for

1 hour at 85℃, 105℃ or 125℃） Note 3, 4

Maximum operating temperature

Preconditioning

None

Temperature

Duration

Maximum operating temperature

1000＋48/－0 hrs

Test

1000＋48/－0 hrs

Methods and

Remarks

Applied voltage

Charge/discharge

current

Rated voltage×2

Rated voltage×2 Note 4

50mA max.

Recovery

6 to 24hr （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

Note: ※LD Low distortion high value multilayer ceramic capacitor

Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.

Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for

24±2hours.

Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in

the test conditions, and kept at room temperature for 24±2hours.

Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.

Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning

measurement results, in order to provide correlation data, the test shall be conducted under the following condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the

"standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

Medium-High Voltage Multilayer Ceramic Capacitor

■RELIABILITY DATA

1. Operating Temperature Range

Temperature Compensating(High Frequency type)

CG(C0G)

: －55 to ＋125℃

Specified Value

High permittivity

X7R, X7S : －55 to ＋125℃

: －55 to ＋85℃

: －25 to ＋85℃

2. Storage Temperature Range

Temperature Compensating(High Frequency type)

CG(C0G) : －55 to ＋125℃

Specified Value

High permittivity

X7R, X7S : －55 to ＋125℃

X5R

: －55 to ＋85℃

: －25 to ＋85℃

3. Rated Voltage

Specified Value

100VDC(HMK,HMJ), 250VDC(QMK,QMJ,QVS), 630VDC(SMK,SMJ)

4. Withstanding Voltage（Between terminals）

Specified Value

No breakdown or damage

Applied voltage

Duration

: Rated voltage×2.5（HMK,HMJ）, Rated voltage×2（QMK,QMJ,QVS）, Rated voltage×1.2（SMK,SMJ）

Test Methods and

Remarks

: 1 to 5sec.

: 50mA max.

Carge/discharge current

５．Insulation Resistance

Temperature Compensating(High Frequency type)

10000MΩ min

Specified Value

High permittivity

100MΩμF or 10GΩ, whichever is smaller.

Applied voltage

Duration

: Rated voltage（HMK,HMJ, QMK,QMJ,QVS）, 500V（SMK,SMJ）

Test Methods and

Remarks

: 60±5sec.

: 50mA max.

Charge/discharge current

6．Capacitance （Tolerance）

Temperature Compensating(High Frequency type)

±0.1pF (C＜5pF) ±0.25pF (C＜10pF) ±0.5pF (5pF≦C＜10pF) ±2%(C=10pF) ±5%(C≧10pF)

Specified Value

High permittivity

±10%, ±20%

Temperature Compensating(High Frequency type)

Measuring frequency

Measuring voltage

Bias application

: 1MHz±10%

: 0.5 to 5Vrms

: None

Test Methods and

Remarks

High permittivity

Measuring frequency

Measuring voltage

Bias application

: 1kHz±10%

: 1±0.2Vrms

: None

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

7．Q or Dissipation Factor

Temperature Compensating(High Frequency type)

C＜30pF : Q≧800＋20C

C≧30pF : Q≧1400

C:Normal Capacitance(/pF)

Specified Value

High permittivity

3.5%max（HMK,HMJ）

2.5%max（QMK,QMJ, SMK,SMJ）

Temperature Compensating(High Frequency type)

Measuring frequency

Measuring voltage

Bas application

: 1MHz±10%

: 0.5 to 5Vrms

: None

Test Methods and

Remarks

High permittivity

Measuring frequency

Measuring voltage

Bas application

: 1kHz±10%

: 1±0.2Vrms

: None

8．Temperature Characteristic of Capacitance

Temperature Compensating(High Frequency type)

C0G :±30ppm（25 to ＋125℃）

High permittivity

Specified Value

: ±10%（－25 to ＋85℃）

X5R

X7R

X7S

: ±15%（－55 to ＋85℃）

: ±15%（－55 to ＋125℃）

: ±22%（－55 to ＋125℃）

Temperature Compensating(High Frequency type)

Capacitance at 25℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

ｆollowing equation.

（C₈₅－C₂₅）

×10⁶×[ppm/℃]

C₂₅×ΔT

High permittivity

Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

Test Methods and

Remarks

Step

X5R、X7R、X7S

Minimum operating tempeature

20℃ 25℃

Maximum operating temperature

（C－C₂）

C₂

×100（%）

: Capacitance value in Step 1 or Step 3

C2 : Capacitance value in Step 2

9．Deflection

Temperature Compensating(High Frequency type)

Appearance

Capacitance change

: No abnormality

:±5% or ±0.5pF, whichever is larger.

Specified Value

High permittivity

Appearance

: No abnormality

: Within±10%

Capacitance change

Warp

: 1mm （Soft Termination type:3mm）

: 10sec.

Duration

Test board

Thicknss

: Glass epoxy-resin substrate

: 1.6mm

Test Methods and

Remarks

Capacitance measurement shall be conducted with the board bent.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

10．Adhesive Strength of Terminal Electrodes

Specified Value

No terminal separation or its indication.

Temperature Compensating(High Frequency type)

Applied force

Duration

: 2N

: 10±5sec.

Test Methods and

Remarks

High permittivity

Applied force

Duration

: 5N

: 30±5sec.

11．Solderability

Specified Value

At least 95% of terminal electrode is covered by new solder

Eutectic solder

Lead-free solder

Sn-3.0Ag-0.5Cu

245±3℃

Solder type

H60A or H63A

230±5℃

Test Methods and

Remarks

Solder temperature

Duration

4±1 sec.

12．Resistance to Soldering

Temperature Compensating(High Frequency type)

Appearance : No abnormality

Capacitance change

Insulation resistance

Withstanding voltage

: C※≦10pF :±0.25pF C※＞10pF :±2.5% ※Normal capacitance

: Initial value

（between terminals） : No abnormality

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within±15%（HMK,HMJ）, ±10%（QMK,QMJ, SMK,SMJ）

: Inital value

: Initial value

（between terminals） : No abnormality

Preconditioning

Solder temperature

Duration

: Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)

: 270±5℃

: 3±0.5sec.

Test Methods and

Remarks

Preheating conditions

Recovery

: 80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5min.

: 24±2hrs under the stadard condition Note3

13．Temperature Cycle （Thermal Shock）

Temperature Compensating(High Frequency type)

Appearance

: No abnormality

Capacitance change

Insulation resistance

Withstanding voltage

: C※≦10pF :±0.25% C※＞10pF :±2.5%

: Initial value

（between terminals） : No abnormality

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within±15%（HMK,HMJ）, ±7.5%（QMK,QMJ, SMK,SMJ）

: Initial value

（between terminals） : No abnormality

Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1

Conditions for 1 cycle

Step

temperature（℃）

Minimum operating temperature

Normal temperature

Time（min.）

30±3min.

2 to 3min.

30±3min.

2 to 3min.

Test Methods and

Remarks

Maximum operating temperature

Normal temperature

Number of cycles : 5 times

Recovery : 24±2hrs under the standard condition Note3

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

14．Humidity （Steady state）

Temperature Compensating(High Frequency type)

Appearance

: No abnormality

Capacitance change

Insulation resistance

: C※≦10pF :±0.5pF C※＞10pF :±5% ※Normal capacitance

: 1000MΩmin

Specified Value

High permittivity

Appearance

: No abnormality

: Within±15%

Capacitance change

Dissipation factor

Insulation resistance

: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.

: 25MΩμF or 1000MΩ, whichever is smaller.

Preconditioning

Temperature

Humidity

: Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)

: 40±2℃

Test Methods and

Remarks

: 90 to 95%RH

Duration

: 500 ＋24/－0 hrs

Recovery

: 24±2hrs under the standard condition Note3

15．Humidity Loading

Temperature Compensating(High Frequency type)

Appearance

: No abnormality

Capacitance change

: C※≦2.0pF :±0.4pF 2.0pF＜C≦10pF : ±0.75pF C※＞10pF :±7.5%

: ※Normal capacitance

: 500MΩmin

Insulation resistance

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within±15%

: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.

: 10MΩμF or 500MΩ, whichever is smaller.

According to JIS 5102 clause 9.9.

Preconditioning

Temperature

: Voltage treatment Note2 (Only High permittivity)

: 40±2℃

Test Methods and Humidity

Remarks Applied voltage

: 90 to 95%RH

: Rated voltage

Charge/discharge current

Duration

: 50mA max.

: 500 ＋24/－0 hrs

: 24±2hrs under the standard condition Note3

Recovery

16．High Temperature Loading

Appearance

Temperature Compensating(High Frequency type)

: No abnormality

Capacitance change

: C※≦10pF :±0.3pF C※＞10pF :±3%

:1000MΩmin

Insulation resistance

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within±15%

: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.

: 50MΩμF or 1000MΩ, whichever is smaller.

According to JIS 5102 clause 9.10.

Preconditioning

Temperature

: Voltage treatment Note2 (Only High permittivity)

: Maximum operating temperature

Test Methods and

Remarks

Applied voltage

Charge/discharge current

Duration

: Rated voltage×2（HMK,HMJ,QVS） Rated voltage×1.5（QMK,QMJ） Rated voltage×1.2（SMK,SMJ）

: 50mA max.

: 1000 ＋24/－0 hrs

Recovery

: 24±2hrs under the standard condition Note3

Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature

for 24±2hours.

Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in

the test conditions, and kept at room temperature for 24±2hours.

Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa

When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted

under the following condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa

Unless otherwise specified, all the tests are conducted under the "standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

Precautions on the use of Multilayer Ceramic Capacitors

■PRECAUTIONS

1. Circuit Design

◆Verification of operating environment, electrical rating and performance

1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have

severe social ramifications.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from

them used in general purpose applications.

Precautions

◆Operating Voltage （Verification of Rated voltage）

1. The operating voltage for capacitors must always be their rated voltage or less.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC

voltage or a pulse voltage having rapid rise time is used in a circuit.

2. PCB Design

◆Pattern configurations （Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.

Therefore, the following items must be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider

appropriate land-patterns for proper amount of solder.

Precautions

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by

solder-resist.

◆Pattern configurations （Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB

cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land

pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.

◆Pattern configurations （Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions

Land patterns for PCBs

（unit: mm）

Wave-soldering

Type

107

1.6

212

2.0

316

3.2

325

3.2

Size

0.8

1.25

1.6

2.5

0.8 to 1.0

0.5 to 0.8

0.6 to 0.8

1.0 to 1.4

0.8 to 1.5

0.9 to 1.2

1.8 to 2.5

0.8 to 1.7

1.2 to 1.6

1.8 to 2.5

0.8 to 1.7

1.8 to 2.5

Reflow-soldering

Type 042

063

0.6

105

1.0

107

1.6

0.8

212

2.0

316

3.2

325

3.2

432

0.4

4.5

Size

Technical

0.2

0.3

0.5

1.25

1.6

2.5

3.2

considerations

0.15 to 0.25

0.15 to 0.20

0.15 to 0.30

0.20 to 0.30

0.25 to 0.40

0.45 to 0.55

0.40 to 0.50

0.45 to 0.55

0.8 to 1.0

0.8 to 1.2

0.9 to 1.6

1.8 to 2.5

1.0 to 1.5

1.2 to 2.0

1.8 to 2.5

1.0 to 1.5

1.8 to 3.2

2.5 to 3.5

1.5 to 1.8

2.3 to 3.5

0.6 to 0.8

Note：Recommended land size might be different according to the allowance of the size of the product.

●LWDC: Recommended land dimensions for reflow-soldering

（unit: mm）

Type

105

0.52

107

0.8

212

1.25

Size

1.0

1.6

2.0

0.18 to 0.22

0.2 to 0.25

0.9 to 1.1

0.25 to 0.3

0.3 to 0.4

1.5 to 1.7

0.5 to 0.7

0.4 to 0.5

1.9 to 2.1

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E06R01

（2）Examples of good and bad solder application

Items

Not eommended

Recommended

Mixed mounting of SMD and

leaded components

Component placement close to

the chassis

Hand-soldering of leaded

Components near mounted

components

Horizontal component

placement

◆Pattern configurations （Capacitor layout on PCBs）

1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any

stresses from board warp or deflection.

possible mechanical

Items

Not recommended

Recommended

Place the product at a right

angle to the direction of the

anticipated mechanical

stress.

Deflection of board

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods

are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,

split methods as well as chip location.

3. Mounting

Precautions

◆Adjustment of mounting machine

1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.

2. Maintenance and inspection of mounting machines shall be conducted periodically.

◆Selection of Adhesives

1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the

following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and

hardening period. Therefore, please contact us for further information.

◆Adjustment of mounting machine

1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid

this, the following points shall be considerable.

Technical

（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.

（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.

considerations

（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be

used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle

placement:

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E06R01

Items

Not recommended

Recommended

Single-sided mounting

Double-sided mounting

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical

impact on the capacitors.

To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of

the pin shall be conducted periodically.

◆Selection of Adhesives

Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in

stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect

components. Therefore, the following precautions shall be noted in the application of adhesives.

（1）Required adhesive characteristics

a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive shall have sufficient strength at high temperatures.

c. The adhesive shall have good coating and thickness consistency.

d. The adhesive shall be used during its prescribed shelf life.

e. The adhesive shall harden rapidly.

f. The adhesive shall have corrosion resistance.

g. The adhesive shall have excellent insulation characteristics.

h. The adhesive shall have no emission of toxic gasses and no effect on the human body.

（2）The recommended amount of adhesives is as follows;

［Recommended condition］

Amount adhesive

After capacitors are bonded

Figure

212/316 case sizes as examples

0.3mm min

100 to 120μm

Adhesives shall not contact land

4. Soldering

◆Selection of Flux

Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall

not be applied.

（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.

（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.

Precautions

◆Soldering

Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.

Sn-Zn solder paste can adversely affect MLCC reliability.

Please contact us prior to usage of Sn-Zn solder.

◆Selection of Flux

1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to

corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.

1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted

and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high

humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning

methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

Technical

considerations

◆Soldering

･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal

shock.

･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within

100 to 130℃.

･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E06R01

［Reflow soldering］

【Recommended conditions for eutectic soldering】

【Recommended condition for Pb-free soldering】

Caution

①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the

thickness of a capacitor.

②Because excessive dwell times can adversely affect solderability, soldering duration shall

be kept as close to recommended times as possible.

③Allowable number of reflow soldering : 2 times max.

［Wave soldering］

【Recommended conditions for eutectic soldering】

【Recommended condition for Pb-free soldering】

Caution

①Wave soldering must not be applied to capacitors designated as for reflow soldering only.

②Allowable number of wave soldering : 1 times max.

［Hand soldering］

【Recommended conditions for eutectic soldering】

【Recommended condition for Pb-free soldering】

⊿T

⊿T≦150℃

⊿T

316type or less

325type or more

⊿T≦130℃

Caution

①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.

②The soldering iron shall not directly touch capacitors.

③Allowable number of hand soldering : 1 times max.

5. Cleaning

Precautions

◆Cleaning conditions

1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use

of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）

2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect

capacitor's characteristics.

1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate

their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.

2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead

the capacitors.

to the

Technical

cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall

be carefully checked;

considerations

Ultrasonic output :

Ultrasonic frequency :

20 W/ℓ or less

40 kHz or less

Ultrasonic washing period : 5 min. or less

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E06R01

6. Resin coating and mold

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the

while left under normal storage conditions resulting in the deterioration of the capacitor's performance.

hardening period or

Precautions

2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat

may lead to damage or destruction of capacitors.

The use of such resins, molding materials etc. is not recommended.

7. Handling

◆Splitting of PCB

1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.

2. Board separation shall not be done manually, but by using the appropriate devices.

Precautions

◆Mechanical considerations

Be careful not to subject capacitors to excessive mechanical shocks.

（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.

（2）Please be careful that the mounted components do not come in contact with or bump against other boards or

components.

8. Storage conditions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control

temperature and humidity in the storage area. Humidity should especially be kept as low as possible.

・Recommended conditions

Ambient temperature : Below 30℃

Humidity

: Below 70% RH

Precautions

The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as

time passes, so capacitors shall be used within 6 months from the time of delivery.

・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.

2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so

care shall be

taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at

150℃ for 1hour.

If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and

quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the

above period, please check solderability before using the capacitors.

Technical

considerations

※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.

Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E06R01

QVS212CG470JDHT [TAIYO YUDEN]

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